|
Process Step
|
Items
|
Capability
|
|
Material
|
Request Material Tg
|
Tetra Functional 136
Tetra Functional 150
High Tg180
|
|
Copper Foil
|
Max. 3 oz
Min. 0.3 oz
|
|
Board
Dimension
|
Panel Size
|
Max. 20"X 24" ( 508mm X 610 mm )
|
|
Array Size
|
Max. 18"X 20" ( 457 mm X 508 mm )
|
|
Board Thickness
|
Max. 157mil ( 4.0mm )
Min. Multilayer: 16mil ( 0.4mm )
|
|
Inner Layer
|
Trace Width / Space
|
Min. 3 / 3 mil
|
|
Copper Weight
|
Max. 2 oz
Min. 0.3 oz
|
|
Core Thickness
|
Max. 80 mil or 2.0 mm
Min. 2mil or 0.76mm
|
|
Lamination
|
Layer Count
|
Max. 14 layers
Min. 2 layers
|
|
Layer to Layer Registration
|
Tolerance  5mil
|
|
Drilling
|
Vias
|
Blind Vias
Buried Vias
|
|
Plated Hole Size
|
Min. 10mil
|
|
Hole to Hole Pitch
|
Min. 40mil
|
|
Drill True Position
|
Tolerance 2mil
|
|
Plating
|
Aspect Ratio
|
1:6
|
|
Through Hole Cu Thickness
|
 0.8mil
|
|
Outer Layer
|
Trace Width / Space
|
Min. 4 / 4mil
|
|
Finished Trace Copper Thickness
|
Max. 4mil
Min. 1mil
|
|
Surface Finish
|
H.A.S.L.
|
Max. 900 
Min. 50
|
|
Electrolytic Gold
|
Max. 30
|
|
Immersion Gold
|
Max. 3
|
|
Immersion Silver
|
Max. 3
|
|
Immersion Tin
|
Max. 3
|
|
Electroless Nickel
|
Max. 500
|
|
Entek, Cu56 & Cu106a
|
Max. 20
|
|
Solder Mask
|
Solder Mask Thickness
|
Max. 0.8mil
Min. 0.4mil
|
|
Solder Mask Dam Width
|
Min. 4mil
|
|
Solder Mask Registration
|
Tolerance 2mil
|
|
Edging
|
Routing Width
|
Min. 30mil
|
|
V-Groove Angle
|
Min. 30
|
|
V-Groove Thickness
|
Min. 8mil
|
|
Bevelling Gradient
|
Min. 25
|
|
Testing
|
SMT Pitch
|
Min. 10mil
|
|
BGA Pitch
|
Min. 32mil
|
|
Impedance Control
|
Tolerance 10%
|
|
Differential Impedance Control
|
Tolerance 10%
|
