Aluminum

Aluminum PCBs are widely used in LED and other advanced technologies to aid in heat dissipation and allow specific illumination. In each, a thin layer of thermally conductive but electrically insulating dielectric material is laminated between a metal base and a copper foil. This is then etched into the preferred circuit pattern while the metal base draws heat away from the circuit through the thin dielectric layer.

Capabilities

  
    Aluminum Type
    5052, 6061, 1100, 1050
    Max. Thickness: 4mm
  
    Min. Thickness: 0.15mm
  
    Copper Substrate
    
    Max. Thickness: 4mm
  
    Min. Thickness: 0.3mm
  
    Thermal Conductivity
    Coefficient of Thermal Conductivity
    1 - 3 w/mk
  
    4 w/mk
  
    5 w/mk
  
    8 w/mk
  
    CEM3
  
    FR4
  
    Board Dimensions
    Single Layer
    Max. Panel Size: 507 x 750mm
  
    Max. Array Size: 477 x 725mm
  
    Double Layer
    Max. Panel Size: 507 x 610mm
  
    Max. Array Size: 477 x 580mm
  
    Inner Layer
    Trace Width / Space
    Min. 3/3mil
  
    Copper Weight
    Max. 3oz
  
    Min. 0.5oz
  
    Core Thickness
    Max. 2mm
  
    Min. 3mil
  
    Lamination
    Double-Sided Multilayer
    Max. 1+1 Layers (with T.H.)
  
    Max. 6+6 Layers (without T.H.)
  
    One-Sided
    Max. 6 Layers
  
    Drilling and Plating
    Plated Hole Size
    Min. 8mil
  
    Mounting Hole Size
    Min. 16mil
  
    Hole to Hole Pitch
    Min. 24mil
  
    Outer Layer
    Trace Width / Space
    3/3mil
  
    Finished Trace Copper Thickness
    Max. 8mil
  
    Finished Trace Copper Thickness
    Min. 0.5mil
  
    Available Surface Finish
    SMT Process
    ENIG
  
    ENEPIG
  
    H.A.S.L. (Lead Free)
  
    Immersion Nickel
  
    Immersion Silver
  
    Immersion Tin
  
    OSP
  
    Silver Electric Plating
  
    COB Process
    Electric Silver Plating
  
    ENEPIG
  
    ENIG
  
    Other
    Anodic Treatment
  
    Blind Drilling
  
    Concave Cup
  
    Countersink Hole
  
    High Reflective Aluminum
  
    Screw Hole Tapping