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Specialized Capabilities
Manufacturing Capabilities
| Material | Requested Material TG (Lead-Free) | Tetra Functional 140°C |
| Tetra Functional 150°C | ||
| High Tg 280°C | ||
| Copper Foil | Max. 6 oz | |
| Min. 0.3 oz | ||
| Material Types | FR4 Laminates | HTE: HTE420, HTE760 |
| Isola: IS410, 370HR, IS415, Getek, FR408 | ||
| ITEQ: IT140, IT158, IT180, T140GTC | ||
| Nan Ya: NP140, NP180 | ||
| Nelco: 4000-13, 5105 | ||
| Panasonic: Mertron4, Mertron6 | ||
| Rogers: RO4003C, RO4350 | ||
| Special Materials | Taconic | |
| Arlon: 35N, 49N, 85N, 92N | ||
| Polymide | ||
| Flex | TAIFLEX, ThinFlex, DuPont | |
| Copper: RA, ED | ||
| Aluminum | 5052, 6061, 1050, 1100 | |
| Prepreg of Aluminum | EM-MP, TCP-2, TCP-4, TCP-8, 1KA04, T30.20 | |
| Board Dimensions | Panel Size | Max. 20" X 24" ( 508 x 610 mm ) |
| Array Size | Max. 18" X 20" ( 457 x 508 mm ) | |
| Board Thickness | Max. 0.42" ( 10.6mm ) | |
| Min. 8mil ( 0.2 mm ) | ||
| Min. Multilayer: 0.016" ( 0.4mm ) | ||
| Inner Layer | Trace Width / Gap | 3/3mil |
| Copper Weight | Max. 6 oz | |
| Min. 1/3 oz | ||
| Core Thickness | Max. 80mil | |
| Min. 2mil | ||
| Outer Layer | Trace Width / Gap | 3/3mil |
| Finished Copper Weight | Max. 6oz | |
| Min. 0.5oz | ||
| Lamination | Layer Count | 1 to 34 layers |
| Core Thickness | Max. 0.080" | |
| Min. 0.003" | ||
| Layer to Layer Registration | Tolerance ±0.005" |
| Drilling | Vias | Blind Vias: Min. 0.008" |
| Buried Vias: Min. 0.0078" | ||
| Laser Drilling Vias: Min.0.004" | ||
| Via-in-Pad: Min. 0.008" | ||
| Via Filling Plating: Min. 0.004" | ||
| Plated Hole Size | Min. Mechanical Drill 8mil | |
| Min. Laser Drill 4mil | ||
| Hole to Hole Pitch | Min. 24mil | |
| True Drill Position | Tolerance ±2mil | |
| BGA | Pad Size | Min. 0.010" |
| Pitch | 16mil | |
| Line Width between Pads | Min. 0.003" | |
| Warp and Twist | Maximum | ≤ Diagonal of 0.5% |
| Tolerance | Routing | ±0.1mm ( 4mil ) |
| Punch | ±0.2mm ( 8mil ) | |
| Depth Control | Outline Tolerance | ±0.127mm ( 5mil ) |
| Depth Control | 10% of Complete Board's Thickness | |
| Plating | Aspect Ratio | 1:10 |
| Through Hole Copper Thickness | Max. 1.4mil | |
| Min. 0.8mil | ||
| Edge Plating (Castellations) | Yes | |
| Surface Finish | H.A.S.L. or Lead-Free H.A.S.L. | Max. 900μ inches |
| Min. 50μ inches | ||
| OSP (Cu56 and Cu106) | Max. 20μ inches | |
| Immersion Gold | Max. 8μ inches | |
| Immersion Silver | Max. 25μ inches | |
| Immersion Tin | Max. 25μ inches | |
| Immersion Nickel | Max. 150μ inches | |
| Nickel-Plating | Max. 100-400μ inches | |
| Electrolytic Gold | Max. 6-7μ inches | |
| Max. 50μ inches (Gold Fingers) | ||
| Solder Mask | Solder Mask Thickness | Max. 0.8mil |
| Min. 0.4mil | ||
| Solder Mask Dam Width | Min. 3mil | |
| Solder Mask Registration | Min. 0.001" | |
| Tolerance ±0.003" | ||
| Silkscreen | Trace Width | Min. 7mil |
| Registration | ±3mil | |
| Peelable Carbon Ink | Yes | |
| Profiling | Routing Width | Min. 30mil |
| V-Cut Angle | 30° - 60° | |
| V-Cut Thickness | Min. 8mil | |
| Beveling | Angle | 15° - 45° |
| Tolerance ±0.127mm | ||
| Testing | SMT Pitch | Min. 10mil |
| BGA Pitch | Min. 32mil | |
| Impedance Control | Tolerance ±10% | |
| Differential Impendance Control | Tolerance ±10% |
Special Processes
Screw Hole Overlay
Countersink Hole
Blind Drilling
Anodic Treatment
Concave Cup