Rigid

Rigid PCBs are designed for circuits requiring complicated layouts or those that may need an array of electric components mounted to them. These boards are well-suited for tasks requiring high durability, greater reliability and long life cycles.

• Capabilities
• High Layer-Count Boards
• Sample Boards

Layers: 12

Material: NELCO 

Board Thickness: 40mil

Surface Mount: Immersion Gold

Other: Edge Plating, 0.004” laser drilled blind vias from layer 1 to 2, buried vias from layer 3 to 6

Layers: 4

Material: FR-402 and Rogers RO4350 mixed

Board Thickness: 62mil

Surface Mount: Immersion Silver

Other: Resin plugged and plate shut

Layers: 4

Material: FR-405 and Rogers (RO4350B) mixed

Board Thickness: 47mil

Surface Mount: Immersion Gold

Other: Edge Plating, certain 0.010” through holes are plugged with resin.

Layers: 6

Material: FR4 Tg170

Board Thickness: 62mil

Surface Mount: Immersion Gold

Other: 0.008" Blind vias from layer 2 to 5, all holes (0.008", 0.010", 0.013") are resine and plating shut, and the trace and width on all layers are 3/3 mil.

Layers: 14

Material: 370 HR

Board Thickness: 80mil

Surface Mount: Immersion Gold

Other: Certain 0.008" through holes are plugged with resin, and 0.008" blind vias from layer 1 to 4 and layer 7 to 14.

Layers: 4

Material: FR4

Board Thickness: 125mil

Surface Mount: Immersion Gold

Other: Beveled top and bottom edge sides, and the left and right edges of the milling area are copper and gold-plated.

Layers: 12

Material: FR406 and RO4350

Board Thickness: 68mil

Surface Mount: Immersion Silver

Other: Edge plating, all holes (0.008", 0.010", 0.018") are plugged with resin, and blind vias from layer 1 to 8 (0.008", 0.010"), layer 1 to 12 (0.018"), and layer 1 to 12 (0.010").

Layers: 4

Material: FR4 Tg140

Board Thickness: 61mil

Surface Mount: Immersion Gold

Other: Blind and buried vias; depth control drilling.